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Welding detection of electronic chips cover plate

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Welding detection of electronic chips cover plate

Product Introduction

Technical Advantages

Product Specifications

ModelLD-GH500
Working PrincipleThe visual CCD system is used to analyze the appearance of the product and make accurate appearance judgment results.
Main Functions

①Cell shell welding quality inspection

②Top cover pre-welding gap and height difference detection

③Cell weld seam inspection

Inspection content

①Welding quality is judged by extracting the weld path around the cell top cover with built-in inspection tools.

②Before the cover and the cell shell are welded, the multi-sensor network measures the gap and face difference between the cell and its metal shell by the built-in tool to generate high-speed 3D laser profile scanning data.

③The scanned weld seam obtains the correct height value by the built-in height detection tool and detects the weld quality (e.g. broken or burst weld) based on Blob analysis.

Feed width range500mm(Customized)
Production Rhythm14ppm-16ppm/min
Dimension2100mm * 2300mm * 2300mm
Equipment weight1600KG

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