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Wafer back-end packaging laser repair machine

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Wafer back-end packaging laser repair machine

Product Introduction

Technical Advantages

Product Specifications

ModelPL-S2
DY-ZK7050
Steady drift of beam pointing<20urad/℃
Incident light spot<9mm
Expanded beam spot<11mm
Scanning depth±10mm @F163Field Mirror
Linearity>99.9%
Scanning angle±0.35rad
Focused spot diameter2um
Minimum line width for short-circuit cutting2um
Minimum line width for break repair5um
X/Y axis tracking time0.15ms
Marking speed<6000mm/s
Z-axis Repeat Positioning Accuracy<1um
X/Y axis drift for a long time (after 30 minutes of warm-up)<0.1rad
Z-axis long time drift (after 30 min warm-up)<5um
Supply power±15V/10A
Lens reflection wavelength1064mm
Laser pulse and power2ns/10W


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