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Wafer test autofocus system

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Wafer test autofocus system

Product Introduction

Technical Advantages

Product Specifications

Magnification5X10X20X50X100X
Depth of Field14um3.5um1.6um0.9um0.6um
Laser sampling rate5kHZ max
Video sampling rate




Laser working range±12000um±4000um±1500um±500um±150um
Video working range±5000um±1000um±400um±100um±20um
AccuracyLaser mode: 0.5x objective depth of field, video 0.25x objective depth of field
LaserDiode laser 660nm, 670nm class llIR<2mw
Operating temperature range+5℃ to + 50℃
Beam shape45° tilted laser line
Sensor + cable weight400g
Interface weight400g
Recommended BS50/50
Laser auto focus cycle time

0.1s
Auto-tracking
Image autofocus cycle time

0.4s
Auto-tracking
Hybrid autofocus cycle time

0.2s
Auto-tracking
Power supplylnSensor only +12v Dc with controller LAF-C 24-48V
Optional distance outputAnalog



Signal quality outputAnalog0-10V&-10+10V&via RS232
CommunicationDigital SignalRS232


Laser on/offlnTTL&via RS232
Camera SynclnTTL



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