Industry Applications
Packaging and palletizing
Intelligent logistics and warehousing
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Non-standard equipment
Integrated Circuits
Semiconductors
Automobile lithium battery
Textile & film
Universal machine
Machine Vision
PCB hard board AOI
Application in lithography circuit board quality inspection
Based on the incoming pixel profile comparison + SDD algorithm to detect, the detection of microwave defects is better than similar models; using the focus on the design of multi-angle LED optical focus and programmable power supply system, adaptable to copper plating / reversed copper foil.
Short data analysis conversion time (3-15MIN) and simultaneous support for multiple formats.
Intelligent analysis of board surface orientation blocks for different size material numbers in successive board feeds and automatic calculation of board orientation information.
Optional offline re-inspection function for initial screening of defects, with AI deep learning interface reserved to realize intelligent VRS.
Self-compiled pixel profile comparison + SDD algorithm to detect, fine-tuned to be compatible with all types of copper plating / reversed copper foil appearance detection.
| Model | AOI-MX20 |
| Minimum line width line spacing | 3mil/3mil |
| Mass production line width | 3.5mil/3.5mil |
| Line Speed | 5.5m/min |
| Max. inspection size | L 27" x W 24" |
| Min. inspection size | L14" x W14" |
| Plate thickness range | 0.3mm-3.2mm(is the thickness of Core material without copper) |
| Image acquisition system | 16K*2 Black and white high-resolution line scan imaging system |
| Data Format | GERBER RS‐274X ODB++ |
| Data conversion time | 3-15 min |
| Detecting the form of plate surface | Signal layer, power ground layer, hybrid shielding layer |
| Test Type | Outer layer (according to customer production requirements) |
| Testing material | FR4、Electroplated copper, secondary copper |
Defect review | Inspection station approval |
| Light source system | Controllable LED concentrated line scan multi-group system |
| Detection method | Comparison of SIP techniques, elemental feature learning, and sub-pixel contour analysis |
| Positioning method | Automatic whole board edge positioning, supports 0°/90°/180° forward/reverse board placement |
| Operation interface | Chinese WINDOWS10 |
| Working environment | 18℃～26℃ |
| Table height | 900-1200mm（Adjustable） |
| Host size | L1600×W1100×H1800mm |
| VRS Size | L1900×W1214×H1260mm |
| VRS effective size | L 31" W x 27.95" |
| Total mass | Approx. 900 KG |
Phone：+86 0513-86550666
Email：jszy@jscostarnet.com
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