2D measurement of wafer back end

The device can automatically adjust the light intensity, switch the light source, lens, automatic optical focus, automatic optical correction, and can inspect the appearance of defects in the post-process of wafers, compatible with 8", 12" wafers. This equipment can automatically adjust the light intensity, switch the light source, lens, automatic optical focus, and automatic optical correction, and can inspect the appearance of defects in the post-process of wafers.

High-resolution optical imaging, automatic optical focus, automatic optical correction, multi-dimensional optical imaging and fast and efficient algorithmic processing capabilities.