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3D wafer appearance inspection equipment

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3D wafer appearance inspection equipment

Product Introduction

Technical Advantages

Product Specifications

ModelJY-TD350
Max. panel size8-12 inch
Min. detection depth350um
Detection principleLattice two-photon effect
Defect CharacteristicsParticles of dust, impurities, etc.
ApplicationsWafer lithography pre-channel wafer die
Detection methodDot Matrix Detection
Power supply220VAC,3500W
Air pressure85-115PSI(6-8kgf/cm2)
Mainframe weight2000Kg
Total sizeL1.75*W1.4*H1.4m


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